| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K4VAF325ZC-SC28 | SAMSUNG/三星 |
BGA |
24+ |
11200 |
||||
| 10M25DAF256C8G | IC |
INTEL/英特尔 |
FBGA-256 |
24+ |
1800 |
|||
| SC200AI-CSBNN00 | IC |
SMARTSENS/思特威 |
CSP |
25+ |
12600 |
|||
| KLUDG8J1ZD-C0CQ | IC |
SAMSUNG/三星 |
BGA |
24+ |
2000 |
|||
| XCF16PFS48C | IC |
XILINX/赛灵思 |
TFBGA-48 |
20+ |
1080 |
|||
| FLXC2002G-C4 | IC |
FORESEE/江波龙 |
FBGA-153 |
23+ |
2160 |
|||
| K4ZAF325BM-HC14 | 存储IC |
SAMSUNG/三星 |
FBGA-180 |
24+ |
7560 |
|||
| MPXV5010DP | IC |
NXP/恩智浦 |
SOP-8 |
25+ |
5000 |
|||
| M321R8GA0EB2-CCP | SAMSUNG/三星 |
DDR5 |
24+ |
1500 |
||||
| CGHV96100F2 | IC |
CREE(科锐) |
23+ |
50 |
||||
| AD202JY | 其他被动元件 |
ADI/亚德诺 |
SIP-10 |
22+ |
900 |
|||
| XQR5VFX130-1CN1752V | 其他被动元件 |
XILINX/赛灵思 |
CGA-1752 |
19+ |
280 |
|||
| 10AS066H3F34I2LG | INTEL/英特尔 |
FBGA-1152 |
24+ |
1200 |
||||
| CM900HG-130X | MITSUBISHI/三菱 |
MODULE |
24+ |
350 |
||||
| PE9354-11 | 美国派根 |
SOP-8 |
16+ |
530 |
||||
| ADXRS620BBGZ | IC |
ADI/亚德诺 |
CBGA-32 |
23+ |
1850 |
|||
| MT53E1G32D2NP-046 WT:B | MICRON/美光 |
WFBGA-200 |
23+ |
6800 |
||||
| MTA36ASF8G72PZ-3G2F1 | MICRON/美光 |
DDR4 |
24+ |
1360 |
||||
| K3LKBKB0BM-MGCP | SAMSUNG/三星 |
FBGA-315 |
24+ |
8520 |
||||
| SS15-0B00-00 | BROADCOM/博通 |
BGA |
23+ |
1080 |
商家默认展示20条库存